Samsung was the first to release a mobile processor, the Exynos 7420, based on 14nm FinFET technology, and now its already competing with TSMC to mass produce chips based on third-generation 14nm semiconductor process. Improved technology brings reduced power consumption as well as production cost.
Samsung recently started mass producing chips based on second generation 14nm FinFET process known as Low Power Plus (LPP), which is claimed to be 15 percent power efficient than first generation (LPE) 14nm chips. The upcoming Exynos 8890 and Snapdragon 820 processors will be manufactured using LPP process.
Bae Young-chang, Vice-President, Department’s Strategy Marketing Team, System LSI, said, “We are going to develop a derivative process that will follow Gen.2 14-nano process and lead mobile chip and foundry markets.” The 14nm and 16nm processes are expected to become ‘longevity' processes, because it has become quite difficult to further reduce the line width.
Read More: Samsung formally adds 10nm FinFET in its foundry’s process roadmap
According to a representative in the chip manufacturing industry, Samsung and TSMC will develop third generation of 14nm and 16nm derivative processes, and focus on securing customers before starting to develop 10nm technology. Even if they successfully develop 10nm technology, there will be a lot of fabless firms that will still use 14nm or 16nm designs.
