Qualcomm has introduced new connectivity chips at MWC 2024, including the FastConnect 7900, which is the first to integrate Bluetooth, Wi-Fi 7, and Ultra Wideband technologies on a single chip. This will enable devices powered by this chip to provide low latency, high-performance, and low-power connectivity.
The new chip also leverages the power of artificial intelligence to provide seamless proximity experiences for locating objects, indoor navigation, and digital keys for vehicles, hotels, etc. It plays a foundational role for the Qualcomm Expanded Personal Area Network and Snapdragon Seamless experiences revealed at the Snapdragon Summit last year.
Qualcomm's new FastConnect 7900 chip is 40% more power efficient
The Qualcomm FastConnect 7900 chip is built on the 6nm process node, a major improvement compared to its predecessor that was built on the 7nm mode. This ensures that the new chip uses 40% less power than the previous version.
There's also support for Qualcomm's next-generation High Bandwidth Simultaneous technology, which leverages the high 5GHz and 6GHz bands for improved multi-link device connectivity. Qualcomm has trained on-device AI models for the FastConnect 7900 to prioritize different types of data streams, such as gaming, text, video conferencing, based on classification and service optimization.
These data types have unique data traffic signatures and while no actual packet inspection is performed in real-time, the AI models on the FastConnect 7900 observe and optimize the bandwidth, allocation, and latency in real-time.
Qualcomm has confirmed that it's going to make the FastConnect 7900 chip available to device manufacturers in the second half of this year. So we can expect devices featuring this chip to be launched either later this year or early next year.
