Samsung reported that they managed to shrink their PCB board
and other components in the upcoming Galaxy S3.
Compared to their flagship the Galaxy S2 they managed to shrink the device so that the thickest point is just 7 mm where the Galaxy S2 allready had an impressive thickness of 8,49 mm.
The Korean message was translated via google translate and as far as we can tell by this translation, the galaxy S3 will have the same “hump”on the back where on the S2 the 8MP camera is fitted.
The Korean source tells us in fact it will also have a 8MP camera capable of recording video at 1080p hd
despite the leaked specs which showed a 12 MP camera. The leaked photo from last year also showed this and was confirmed by Eldar Murtazin.
Furthermore there is a 3D-enabled model mentioned in the message but its not exactly clear if this applies to display / camera or both.
The google translation was quite messy and hard to read but we could see some dates mentioned being : May and March 2012.
May seems like a goal that Samsung could make in time. The month March is supposed to be the month where Samsung started working on the Galaxy S3.
If the rumor is true the phone will most likely be produced with a plastic cover again.
It just seems too farfetched that Samsung can create a 7 mm thin case in time for the launch.
Off course there will be a lot more rumors before the launch but a quad-core processor and LTE connectivity are mentioned in this message as well as in previous rumors
The question stays whether it will be the 1.8GHz quad-core Exynos 4412, or the Exynos 5-series monsters that Samsung demonstrated recently.
