There's been a lot of focus on Samsung's semiconductor division recently. The business faces considerable challenges and it has been unable to contribute as much to Samsung's revenues as it did in the past.
Every bit of news concerning the semiconductor division gets analyzed closely as to what it might mean for the future for the business. The latest news concerns the departure of a key chip expert that previously spent nearly two decades at TSMC before joining Samsung two years ago.
Lin's two-year contract at Samsung is now up
Jing-Cheng Lin was appointed a VP at Samsung's Semiconductor Research Institute System Package Lab when he was brought on to work on chip packaging technology. He's an expert in this field, having previously worked at the Taiwan Semiconductor Manufacturing Company from 1999 to 2017.
With Moore's Law reaching its limit, advancement in packaging capabilities has become crucial for next-generation advanced chips. Samsung has been investing in building a robust advanced packaging business team since 2022. Lin was brought on board to assist with the expansion of Samsung's packaging business.
He played an integral role in developing the packaging technology for HBM4 memory. Samsung has a lot riding on HBM4 after it lost a significant chunk of the HBM3E market to cross-town rival SK Hynix. It needs to win big in HBM4 if Samsung wants to capitalize on the AI trend.
Lin confirmed his departure from Samsung on LinkedIn, highlighting that his two-year contract at the company is now up, highlighting contributions made to Samsung's advanced packaging technologies, including hybrid copper bonding for 3DIC and HBM-16H.
