Snapdragon chip for Galaxy S27 and Galaxy Z Fold 9 to debut in September

Qualcomm has revealed the date for its Snapdragon Summit 2026 event. This is where the company is expected to unveil its next-generation high-end chips for laptops, smartphones, and tablets. The higher-clocked version of its upcoming flagship smartphone chip will likely power the Galaxy S27 series and the Galaxy Z Fold 9 series.

The next Snapdragon Summit will take place in Maui, Hawaii, from September 22 to 24, 2026. Qualcomm confirmed the event’s date and location by publishing an image on Instagram. According to reports, the chipmaker will unveil two new chips during the event: the Snapdragon 8 Elite Gen 6 and the Snapdragon 8 Elite Gen 6 Pro. Both chips are rumored to be fabricated on TSMC’s 2nm process node.

Based on Samsung’s track record, the higher-clocked Snapdragon 8 Elite Gen 6 Pro could be used in six devices:

The Galaxy S27 and the Galaxy S27+ could use Samsung's own Exynos 2700 chip with side-by-side (SBS) cooling in most markets globally. It could be fabricated on Samsung Foundry's second-generation 2nm process node.

The Snapdragon 8 Elite Gen 6 is said to feature an eight-core CPU with clock speeds of up to 4.4GHz, an Adreno 845 GPU with 12MB of graphics memory, and support for LPDDR5X DRAM. The Snapdragon 8 Elite Gen 6 Pro could feature an eight-core CPU with clock speeds of up to 5GHz, an Adreno 850 GPU with 18MB of graphics memory, and support for LPDDR5X or LPDDR6 DRAM.

Qualcomm could also announce two additional high-end chips for premium smartphones that sit below flagship models. They are rumored to be the Snapdragon 8 Elite Gen 5XX Edition and the Snapdragon 8 Gen 5 Pro. Both chips are said to be built on a 3nm process.