DEAL Galaxy S24 FE, Galaxy Watch 7. Subscribe today and be the first to learn about One 7 beta!

SamMobile has affiliate and sponsored partnerships. If you buy something through one of these links, we may earn a commission.

News For You
News For You
Notifications

Samsung develops new technology to make faster and more efficient chips

General
By 

Last updated: May 6th, 2021 at 06:34 UTC+02:00

Samsung, the world leader in semiconductor space, has announced that it has developed a new chip packing technology that could make chips faster and more power-efficient. The I-Cube4 technology is an improvement over the company's I-Cube 2 technology from 2018 and X-Cube technology from 2020.

The company's I-Cube4 (Interposer-Cube4) is a 2.5D heterogeneous chip packaging technology. It can be used to horizontally place multiple logic dies (CPU, GPU, and NPU) and several HBM (High Bandwidth Memory) dies on top of a silicon interposer, making several dies act as a single chip. This technology was developed in March 2021, and it has already been used to put one logic die, and four HBM dies on a single chip.

Samsung says that chips made using i-Cube4 technology can be used in high-performance applications such as 5G, AI, cloud, and large data centers. This technology enables even faster communication between the memory and logic units of a chip.

Samsung I-Cube4 Package Structure

Since the silicon interposer in the I-Cube4 is thinner than paper, there is a probability of bending and warping, negatively affecting the product quality. However, Samsung Foundry has carefully studied how to control interposer warpage and thermal expansion by changing the material and thickness, removing the problems. It has also developed its own mold-free structure to dissipate heat efficiently.

The company has also enhanced the yield by conducting a pre-screening test to identify defective products during fabrication. This process removes excessive steps in the process, saves costs, and improves turnaround times. Samsung is also developing even better technology called I-Cube6 by using advanced process nodes, advanced 2.5D and 3D packaging, and high-speed interface tech.

Moonsoo Kang, Senior Vice President of Foundry Market Strategy at Samsung Electronics, said, “With the explosion of high-performance applications, it is essential to provide a total foundry solution with heterogeneous integration technology to improve the overall performance and power efficiency of chips. With the mass-production experience amassed through I-Cube2 and the commercial breakthroughs of I-Cube4, Samsung will wholly support customers’ product implementations.

Samsung I-Cube4 Chip Packaging Technology

General Samsung Foundry
Galaxy AI summarized

Scroll for more related content
News For You

You might also like

Intel could tie up with Samsung to fight against TSMC

Intel could tie up with Samsung to fight against TSMC

Samsung has been trying for years to compete with TSMC in contract chip manufacturing. However, it hasn't succeeded. In fact, it continuously lost its clients, including Nvidia and Qualcomm, to TSMC. Intel Foundry, which entered the contract chip manufacturing space with huge ambitions, also failed. Now, both companies are thinking of forming an alliance to […]

  • By Asif Iqbal Shaik
  • 22 hours ago
Samsung loses out on Snapdragon 8 Elite fabrication to TSMC

Samsung loses out on Snapdragon 8 Elite fabrication to TSMC

Samsung Foundry has been finding it difficult to compete with TSMC. Some of the world's leading chip designers are opting for the latter to get their chips fabricated. This means that Samsung loses out on billions of dollars in business, despite having invested significant sums in its foundry to provide manufacturing capacity for advanced chips. […]

  • By Adnan Farooqui
  • 1 week ago
Nvidia could get some of its gaming chips made by Samsung

Nvidia could get some of its gaming chips made by Samsung

Over the past couple of years, Samsung has lost two big-name chip clients—Nvidia and Qualcomm—to TSMC due to power consumption issues. However, Nvidia could come back to Samsung Foundry in the future, as it doesn't want to rely too much on TSMC for its future chips. This is great news for Samsung. Nvidia's future GPUs […]

  • By Asif Iqbal Shaik
  • 2 weeks ago
Samsung makes 24Gb GDDR7 DRAM chips for next-gen GPUs

Samsung makes 24Gb GDDR7 DRAM chips for next-gen GPUs

Samsung has announced it has developed the world's first 24GB GDDR7 DRAM memory chip for GPUs. This high-capacity memory chip, featuring the fastest performance in the industry, will be used in flagship GPUs next year, advancing performance and efficiency. It was also the first brand in the world to complete the development of GDDR7 chips. […]

  • By Asif Iqbal Shaik
  • 2 weeks ago
Samsung to make 2nm AI accelerator chips for Rebellions

Samsung to make 2nm AI accelerator chips for Rebellions

Samsung has announced that it has partnered with chip firms ADTechnology, ARM, and Rebellions for the development of an AI CPU chiplet platform. Despite being the world's second-biggest contract chip manufacturer, its advanced process nodes haven't been used by many big-name brands recently, but its 2nm Gate-All-Around (GAA) process will be used by Rebellions. Samsung […]

  • By Asif Iqbal Shaik
  • 2 weeks ago
Samsung about to cut high-ranking executive jobs across key divisions

Samsung about to cut high-ranking executive jobs across key divisions

Although Samsung recently said it has no plans to spin off its Foundry and System LSI divisions, the tech conglomerate will reportedly cut significant executive job numbers throughout its chip-making arms before the end of 2024. A new report citing industry sources says the head of the Device Solutions (DS) division, under which Samsung's semiconductor […]

  • By Mihai Matei
  • 3 weeks ago