Samsung is well positioned to cash in on the AI boom due to its diversified range of semiconductor products. The company is already seeing increasing demand for its high-bandwidth memory as well as its chip packaging technology.
Samsung Electro-Mechanics, a division of the conglomerate that produces important components for chips, is looking to expand its footprint in the AI chip market by doubling its sales of semiconductor package substrates.
Flip Chip-Ball Grid Array production to begin later this year
The company recently started mass production of its semiconductor package substrates for AI PCs. It's now looking to produce Flip Chip-Ball Grid Array in the second half of this year for AI servers. The company had announced a significant investment in this technology back in 2021 and has been working on expanding its production lines.
The mass production of its package substrates for AI PCs has reportedly been a success. These were supplied to a US-based semiconductor company. Samsung Electro-Mechanics has reportedly met the initial yield targets and also passed performance evaluations by the customer.
These components have increased the area by over 30% and reduced the circuit line width by 30% compared to conventional PC substrates. They're capable of supporting the high-performance requirements of on-device AI products, thereby meeting a key performance requirement of the customer.
The company is now looking to expand the application of these substrates beyond PCs to servers and smartphone as well, with substrate sales for servers to begin in the second half of this year. This strategy should enable Samsung to more than double its sales in this segment.
